The C-Tec EFP 3.0 is an electronic fine polishing unit designed to provide fast and reliable polishing of the crimping surface, enabling metallographic cross-sections to be prepared directly in the production area.
As part of the Microlab product family, the EFP 3.0 allows crimping surfaces to be quickly prepared for subsequent metallographic cross-section evaluation and documentation. High-quality polishing is essential for fast and effective analysis of crimp cross-sections.
The evaluation of the metallographic cross-section is an important tool for verifying crimping quality and monitoring the production process. The C250 polishing liquid contains no harmful substances, meaning that no special provisions are required for the polishing process.
The EFP 3.0 features a practical polishing pen, easily replaceable polishing tips and small and large polishing heads, allowing it to be used for different cross-sectional areas.
The polishing voltage can be continuously adjusted from 1 to 16 V, while polishing performance can be adjusted from 1 to 100%. The unit also provides 3 presets for polishing parameters and flexible use with various electrolytic liquids.
| Specification | Value |
|---|---|
| Equipment Type | Electronic Fine Polishing Unit |
| Application | Crimping surface polishing and metallographic cross-section preparation |
| Product Family | Microlab |
| Polishing Liquid | C250 |
| Polishing Pen | Included |
| Polishing Tips | Easily replaceable |
| Polishing Heads | Small and large |
| Polishing Voltage | 1–16 V, continuously adjustable |
| Polishing Performance | 1–100% |
| Presets | 3 polishing parameter presets |
| Electrolytic Liquids | Flexible use with various liquids |
