C-Tec EFP3.0

The EFP 3.0 electronic fine polishing unit facilitates fast and reliable polishing of the crimping surface.

The Electronic Fine Polishing device EFP 3.0 - as part of the Microlab product family - facilitates the fast polishing of the crimp surface. The polishing liquid C250 does not contain any harmful substances. Therefore no special provisions are required for the polishing process. The microsections can be prepared in situ of the production area. A good polishing quality is a prerequisite for the fast and efficient evaluation and documentation of the microsection. The evaluation and documentation of the microsection is a perfect proof of the crimp quality and a reliable tool to monitor production.

Performance Features

  • Processing of the cross section by a handy polishing pen
  • Easily exchangeable polishing tips
  • Small and large polishing heads for different cross sections
  • Infinitely adjustable polishing voltage from 1 to 16 V
  • Adjustable polishing performance from 1% to 100%
  • Three presets for polishing parameters
  • Flexible in use for various electrolyte liquids
Design sem nome (14)

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